Call for Papers (Extended Deadline): 2007 International Conference on Modeling, Simulation and Visu

Discussion in 'VHDL' started by A. M. G. Solo, Feb 21, 2007.

  1. Dear Colleagues:

    I would appreciate if you would share the announcement below with
    those
    who might be interested.

    Best regards,

    A. M. G. Solo
    Publicity Chair, MSV'07
    Principal/R&D Engineer, Maverick Technologies America Inc.
    ----------------------------------------------------------

    Last Call For Papers

    The 2007 International Conference on Modeling,
    Simulation and Visualization Methods (MSV'07)

    Date and Location: June 25-28, 2007, Las Vegas, USA

    Academic Sponsors: Research Labs at
    MIT, Harvard, Purdue, Univ. of Texas at Austin, ...

    Paper Submission Deadline: March 4, 2007
    url: http://www.world-academy-of-science.org/worldcomp07/ws/MSV07


    You are invited to submit a full paper for consideration.
    All accepted papers will be published in the conference proceedings.

    SCOPE: Topics of interest include, but are not limited to,
    the following:

    O Simulation languages
    O Modeling and simulation for computer engineering
    O Modeling and simulation for education and training
    O Real-time modeling and simulation
    O Information and scientific visualization
    O Perceptual issues in visualization and modeling
    O Modeling methodologies
    O Specification issues for modeling and simulation
    O Visual interactive simulation and modeling
    O Visualization tools and systems for simulation and modeling
    O Java-based modelers
    O Scalability issues
    O Numerical methods used in simulation and modeling
    O Finite and boundary element techniques
    O Process simulation/modeling
    O Device simulation/modeling
    O Circuit simulation/modeling
    O Multi-level modeling
    O Prototyping and simulation
    O Biomedical visualization and applications
    O Databases and visualization
    O Interaction paradigms and human factors
    O Parallel and distributed simulation
    O Discrete and numeric simulation
    O Internet, web and security visualization
    O Virtual reality and simulation
    O Tools and applications
    O Virtual environments and data visualization
    O Object-oriented simulation
    O Knowledge-based simulation
    O Simulation of machine architectures
    O Simulation of wireless systems
    O Simulation of semiconductors and microelectronics
    O Simulation and modeling with applications in biotechnology
    O Simulation and modeling with applications in nanotechnology
    O CAD/CAE/CAM
    O Emerging technologies and applications

    Submission of Papers:

    Prospective authors are invited to submit their full paper
    (about 5 to 8 pages - single space, font size of 10 to 12) to
    H. R. Arabnia by Mar. 4, 2007 (). E-mail submissions
    in MS Doc or PDF formats are preferable (postal mail submissions
    are also fine.) All reasonable typesetting formats are acceptable
    (later, the authors of accepted papers will be asked to follow a
    particular typesetting format to prepare their papers for
    publication.)

    The length of the Camera-Ready papers (if accepted) will be limited
    to
    7 (IEEE style) pages. Papers must not have been previously
    published
    or currently submitted for publication elsewhere. The first page
    of
    the draft paper should include: title of the paper, name,
    affiliation,
    postal address, email address, and telephone number for each
    author.
    The first page should also identify the name of the author who will
    be presenting the paper (if accepted) and a maximum of 5 topical
    keywords that would best represent the content of the paper.

    Each paper will be refereed by two experts in the field who are
    independent of the conference program committee. The referees'
    evaluations will then be reviewed by two members of the program
    committee who will recommend a decision to the chair of the track
    that
    the paper has been submitted to. The track chair will make the
    final
    decision. Lastly, the Camera-Ready papers will be reviewed by one
    member of the program committee.

    Members of Program and Organizing Committees:

    The Program Committee includes members of chapters of World Academy
    of Science (chapters: supercomputing; scientific computing;
    artificial
    intelligence; imaging science; databases; simulation; software
    engineering; embedded systems; internet and web technologies;
    communications; computer security; and bioinformatics.) Many
    members
    of the program committee for individual conferences include
    renowned
    leaders, scholars, researchers, scientists and practitioners of the
    highest ranks; many are directors of large research laboratories,
    IEEE Fellows, heads/chairs of departments, deans and provosts.
    Each committee also includes two Student Members (in their final
    stages
    of their PhD programs) who are identified as such. Refer to the
    conference web sites for the list of members of program committee.

    Co-Sponsors (a partial list):

    Academic Co-Sponsors of WORLDCOMP'07 include:
    - Massachusetts Institute of Technology (MIT) Media Laboratory,
    MIT (Cambridge, Massachusetts)
    - Statistical Genomics and Computational Biology Laboratory,
    Department of Statistics, Harvard University (Cambridge,
    Massachusetts)
    - Texas Advanced Computing Center, The University of Texas at
    Austin (Austin, Texas)
    - Statistical and Computational Intelligence Laboratory of
    Purdue University (West Lafayette, Indiana)
    - University of Iowa's Medical Imaging HPC Lab (Iowa City, Iowa)
    - Institute for Informatics Problems of the Russian Academy of
    Sciences, Moscow, Russia);
    Other Co-sponsors include:
    - HPCwire
    - GRIDtoday
    - STEM Education Society
    - HPCSoft, HPC Software Inc.
    - International Technology Institute
    - H2cM - Hodges' Health, UK

    Purpose / History:

    MSV'07 will be held in conjunction with WORLDCOMP'07
    (http://www.world-academy-of-science.org/worldcomp07/ws ).
    WORLDCOMP'07 is the largest gathering of researchers in computer
    science, computer engineering and applied computing.
    Many of the tracks of WORLDCOMP are considered to be the premier
    meetings for presentation of advances in their respective fields.
    We anticipate to have 2000 or more attendees from over 75
    countries participating in the 2007 event.

    The motivation is to assemble a spectrum of affiliated research
    conferences into a coordinated research meeting held in a common
    place at a common time. The main goal is to provide a forum for
    exchange of ideas in a number of research areas that interact. The
    model used to form these annual conferences facilitates
    communication
    among researchers from all over the world in different fields of
    computer science, computer engineering and applied computing. Both
    inward research (core areas of computer science and engineering)
    and
    outward research (multi-disciplinary, inter-disciplinary, and
    applications) will be covered during the conferences.

    Important Dates:

    March 4, 2007: Submission of full papers (about 5 to 8 pages)
    March 20, 2007: Notification of acceptance
    April 20, 2007: Camera-Ready papers and Registration due
    June 25-28, 2007: The 2007 International Conference on Modeling,
    Simulation and Visualization Methods (MSV'07)
     
    A. M. G. Solo, Feb 21, 2007
    #1
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